| 发明名称 | Substrate recycling method | ||
| 摘要 | Embodiments of the disclosure relate to a substrate recycling method and a recycled substrate. The method includes separating a first surface of a substrate from an epitaxial layer; forming a protective layer on an opposing second surface of the substrate; electrochemically etching the first surface of the substrate; and chemically etching the electrochemically etched first surface of the substrate. | ||
| 申请公布号 | US9514926(B2) | 申请公布日期 | 2016.12.06 |
| 申请号 | US201514703773 | 申请日期 | 2015.05.04 |
| 申请人 | SEOUL VIOSYS CO., LTD. | 发明人 | Hong Su Youn;Choi Joo Won;Heo Jeong Hun;Shin Su Jin;Lee Choong Min |
| 分类号 | H01L21/02;H01L21/306;H01L33/00 | 主分类号 | H01L21/02 |
| 代理机构 | Perkins Coie LLP | 代理人 | Perkins Coie LLP |
| 主权项 | 1. A method of recycling a substrate, the method comprising: separating a first surface of a substrate from an epitaxial layer; forming a protective layer on a second surface of the substrate; chemically etching the first surface of the substrate; and before the chemically etching of the first surface of the substrate, forming the protective layer on at least a portion of a side surface of the substrate. | ||
| 地址 | Ansan-Si KR | ||