WIRELESS COUPLING OF STACKED DIES WITHIN SYSTEM IN PACKAGE
摘要
A multi-chip module (MCM) includes a plurality of semiconductor dies within a single package. RF transceivers on two or more of the dies provide inter chip communications between the dies permitting the establishment of communications without requiring that hardwire connections be established for each signal connection.
申请公布号
WO2005041257(A2)
申请公布日期
2005.05.06
申请号
WO2004US28034
申请日期
2004.08.27
申请人
INTERDIGITAL TECHNOLOGY CORPORATION;KAEWELL, JOHN, DAVID, JR.