| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that has a small area for packaging, and is small-sized and low-priced. <P>SOLUTION: The semiconductor device has a package (22) that contains a semiconductor element in it, and a lead frame. The lead frame is composed of a frame part (40) onto which a semiconductor element is mounted, and a lead part (26) that projects from one side of the package (22). The semiconductor element includes two power switching semiconductor elements (30, 32) and a control semiconductor element (38) that controls the two. The lead part (26) is a sequence of multiple leads linked to respective frames (50-58) of the frame part (40). The lead (Tc), which mounts one power switching semiconductor element (32) and is linked to the frame (52) electrically connected to the other power switching semiconductor element (30), is arranged at the end of the sequence. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
