RESIN COMPOSITION FOR PRINTED WIRING BOARD, AND VANISH, PREPREG AND METAL-CLAD LAMINATE USING SAME

摘要

A resin composition for printed wiring boards usable in electronic devices wherein the operating frequency exceeds 1 GHz, and a varnish, a prepreg and a metal-clad laminate using such a resin composition are disclosed. The resin composition includes a cyanate ester compound having two or more cyanato groups in the molecule and/or a prepolymer of such a cyanate ester compound, and an epoxy resin containing at least one epoxy resin having the biphenyl skeleton in the molecule.