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发明名称
HEAT SPREADER PACKAGE AND FABRICATING METHOD THEREOF, CONCERNED WITH IMPROVING HEAT RADIATION EFFECT
摘要
申请公布号
KR100499398(B1)
申请公布日期
2005.06.25
申请号
KR19970080685
申请日期
1997.12.31
申请人
HYNIX SEMICONDUCTOR INC.
发明人
KIM, YONG CHAN
分类号
H01L23/34;(IPC1-7):H01L23/34
主分类号
H01L23/34
代理机构
代理人
主权项
地址
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