| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device in which reliability in connection between bump electrodes and board electrodes is improved. <P>SOLUTION: When the post-thermosetting elastic modulus of an adhesive 3, which is used to connect metal bumps 2 electrically to a wiring pattern 4 and to seal an LSI circuit surface of an LSI chip 1, is Ea, the post-thermosetting elastic modulus of an insulating material 5 on the surface layer of a mounting board 8 is Eb, and the post-thermosetting elastic modulus of a core material 6 is Ec when the board of the semiconductor device is a multilayer board having a core layer, the following inequalities (1) are satisfied regarding with the material composition of the semiconductor device under an ambient temperature and a thermocompression temperature for the adhesive 3: at least Ea<Eb<Ec, or preferably 1/3Eb<Ea<Eb<3Ea (<Ec). With elastic moduli set according to the inequalities (1), the connection condition of the semiconductor device is stabilized regardless of the size of pressure contact load or nonuniformity in mass production the device, thus a high yield of the device can be realized at low costs. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
