| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance a working efficiency of grinding by reducing a pretreatment step wherein a dummy wafer is used. <P>SOLUTION: An abrasive pad 1 of the present invention has a ground surface with a surface roughness set at 0.1 μm or more and 3.7 μm or less by an arithmetic average roughness Ra, and requires no pretreatment step wherein a dummy wafer is used. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
