| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component wherein delamination is eliminated and high dimensional accuracy is installed. <P>SOLUTION: The method for manufacturing an electronic component is provided with a process for forming a first ceramic green sheet layer 2 on a support 1, a process wherein a second ceramic green sheet layer 3 is formed on the first ceramic green sheet layer 2 and a ceramic green sheet 4 is formed, a process for forming a conductor layer 5 on the second ceramic green sheet layer 3 of the ceramic green sheet 4, a process wherein a plurality of the ceramic green sheets 4 on which the conductor layers 5 were formed are laminated and heated, and a ceramic green sheet lamination 6 is formed, and a process for baking the ceramic green sheet lamination 6. Furthermore, the first ceramic green sheet layer 2 contains melting component which will be in melting status at the time of heating when the ceramic green sheet lamination 6 is formed. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
