| 摘要 |
PROBLEM TO BE SOLVED: To suppress cracks from being generated by reducing generation of stress.SOLUTION: In a package for an electronic component in which a frame part is provided on one principal surface of a flat-plate substrate part and a recess is formed, a pair of two external terminals consisting of conductive film materials is provided on a principal surface side of the substrate part opposite to the principal surface on which the frame part is provided, the conductive film materials constituting the respective external terminals are provided on three side surfaces of the substrate part and the substrate part so as to cover two adjacent corners of the substrate part, and the conductive film materials are formed so that curved contours are formed on the substrate part side, straight contours are formed on the two side surface sides in parallel with the substrate part held therebetween and the interval of the pair of two external terminals on the substrate part side becomes narrower as it approaches the center side of the substrate part. |
