| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a negative photosensitive polyimide precursor composition which gives a resin film having a small coefficient of thermal expansion and thereby, reducing decrease in adhesion property with a base material or warpage of the base material and causing no deterioration in electric characteristics, resolution or the like. <P>SOLUTION: The negative photosensitive polyimide precursor composition contains: a polyimide precursor having a benzoxazole skeleton in the main chain and a photo-crosslinking group in a side chain; and a photo initiator. As the negative polyimide precursor composition has a small coefficient of thermal expansion after polyimidization, it shows little difference in the coefficient of thermal expansion after applied on a substrate having a small coefficient of thermal expansion such as a silicon wafer and thermally cyclized. The composition has preferable adhesion property with the base material and reduces warpage, or can keep preferable developing property and photosensitivity, which results in a preferable pattern. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
