发明名称 LOW TEMPERATURE POLY-SILICON BACKPLANE AND MANUFACTURING METHOD THEREOF, AND LIGHT-EMITTING DEVICE
摘要 Provided are a low temperature poly-silicon (LTPS) backplane and a manufacturing method thereof, and a light-emitting device. The LTPS backplane comprises: a substrate (11), and a thin film transistor (TFT) (12) and a light-blocking layer (13) located above the substrate (11), the light-blocking layer (13) being located above the TFT (12). The light-blocking layer (13) is used to block an incident light from irradiating the TFT (12).
申请公布号 WO2016206236(A1) 申请公布日期 2016.12.29
申请号 WO2015CN91959 申请日期 2015.10.15
申请人 BOE TECHNOLOGY GROUP CO., LTD. 发明人 XU, Xiaowei;LIU, Libin;LI, Liangjian;LONG, Chunping
分类号 H01L27/12;H01L21/77;H01L23/552 主分类号 H01L27/12
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