| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a packaging method of a video image sensor which can perform solder reflow in the state that an adhesive tape is left to be pasted in a light receiving side of the video image sensor, and enables the light receiving side of the video image sensor during the solder reflow to be protected in a packaging process of the video image sensor using a solid image pickup device, and to provide the adhesive tape for protection used for it. <P>SOLUTION: In the packaging process of the video image sensor using the solid image pickup device, the packaging method is characterized in that a polyimide film is used as a substrate, in that at least one part of the outer periphery has a projection 3a for lifting, and in that a terminal of the video image sensor is connected with a substrate side in the solder reflow by heating at 170 °C or more in the state that an adhesive tape 3 having an adhesion layer in at least one side is pasted with a light-receiving section 2 of the above-mentioned video image sensor. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
