| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component capable of carrying out sealing with a resin without using a metal mold. <P>SOLUTION: This manufacturing method of the electronic component comprises the first step of forming a frame 12a having a height corresponding to a resin mold with a resist 12 around each element region on the surface of a mounting substrate 11, the second step of then mounting an element chip 14 on each region exposed within the frame on the mounting substrate, the third step of then injecting a sealing resin 15 inside the frame on the mounting substrate to surround the element chip and curing it, and the fourth step of lastly removing the frame from on the mounting substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
