| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive-type photosensitive resin precursor composition giving a resin film having high exposure sensitivity, superior pattern forming property and heat resistance. <P>SOLUTION: The positive-type photosensitive resin precursor composition contains a resin precursor selected from a polyimide precursor containing a weak acidic group soluble under an alkali condition and a polybenzoxazol precursor, a photo-acid initiator and an acid derivative structured, by substituting an acid instable group for hydrogen atom of carboxyl group of cholic acid, deoxycholic acid or lithocholic acid. The acid instable group substantially is not decomposed by an acidity of the weak acid group but is decomposed by an acid produced from the photo-acid initiator. A resin, formed by the positive-type photosensitive resin precursor composition, is used as a semiconductor protective film or an interlayer insulating film. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
