发明名称 Testing holders for chip unit and die package
摘要 A testing holder for a chip unit, a multi site holding frame for plural chip units and a method for testing a die thereof are provided. The proposed multi site holding frame for testing plural chip units simultaneously includes a first holder frame having a plurality of testing holders. Each of the plurality of testing holders includes a holder body containing a specific one of the plural chip units, and a pressure releasing device formed on the holder body to release an insertion pressure when the specific one of the plural chip units is inserted in the holder body.
申请公布号 US9453877(B2) 申请公布日期 2016.09.27
申请号 US201615098037 申请日期 2016.04.13
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 Wang Mill-Jer;Liu Kuo-Chuan;Peng Ching-Nen;Lin Hung-Chih;Chen Hao
分类号 G01R31/00;G01R31/28;G01R1/04 主分类号 G01R31/00
代理机构 McDermott Will & Emery LLP 代理人 McDermott Will & Emery LLP
主权项 1. A testing holder for a chip unit, comprising: a holder body containing the chip unit; and a pressure releasing device formed on the holder body to release an insertion pressure when the chip unit is inserted in the holder body, wherein the holder body comprises a bottom plate, the chip unit includes a bottom surface facing the bottom plate, wherein the bottom plate comprises one set of a first set of plural pogo pins and a second set of plural soft spacers for absorbing a contact stress from the insertion.
地址 Hsinchu TW