发明名称
摘要 PROBLEM TO BE SOLVED: To provide an anisotropical conductive adhesive agent which is capable of mounting an electronic part stably on a circuit board connecting the part surely and electrically to the board, and a method of mounting an electronic part by the use of the adhesive agent. SOLUTION: An adhesive sheet is composed of an insulating resin sheet 5, conductive film electrodes 4 which are formed on both the sides of the resin sheet 5 where electrical connectors are formed and electrically connected together through through-holes 8 provided to the sheet 5, and thermosetting insulating adhesive agent layers 6 mounted on both the sides of the resin sheet 5, and the resin sheet 5 is formed of shape memory resin sheet and returned to a prescribed shape where the center of the conductive film electrode 4 or its vicinity protrudes towards the one side of the resin sheet 5 when the resin sheet 5 is heated at a lower temperature than the curing temperature of the thermosetting insulating adhesive agent layers 6. An electronic part is mounted on a circuit board 7 by the use of the above adhesive sheet.
申请公布号 JP3745524(B2) 申请公布日期 2006.02.15
申请号 JP19980001026 申请日期 1998.01.06
申请人 发明人
分类号 C09J7/02;H01L21/60;C09J201/00;H05K3/32 主分类号 C09J7/02
代理机构 代理人
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