| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition which can give a resin film having high exposure sensitivity, preferable pattern forming property and excellent heat resistance. <P>SOLUTION: The positive photosensitive resin composition contains a resin precursor selected from polyimide precursors and polybenzoxazole precursors having at least either a carboxyl group or a phenolic hydroxyl group, an acid derivative prepared by producing p-nitroarylmethylesters of cholic acid, deoxycholic acid or lithocholic acid, and a sensitizer. The resin produced by using the above positive photosensitive resin composition can be used as a semiconductor protective film or an interlayer insulating film. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
