| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayer electronic component wherein the so-called sheet attack phenomenon does not occur when an electrode pattern layer is formed on a surface of a green sheet, so that shortcircuit defectives of an obtained electronic component is few. <P>SOLUTION: The method for manufacturing a multilayer electronic component is provided with a step for forming a lower side green sheet 10a including at least ceramic powder on a support 20, a step for forming an electrode pattern layer 12a on a surface of the lower side green sheet, a step for forming a green chip by stacking multilayer units U1 including at least the lower side green sheet and the electrode pattern layer, and a step for baking the green chip. In the lower side green sheet 10a formed on the support 20 includes a binder of a curable resin. The curable resin in the lower side green sheet 10a is cured before forming the electrode pattern layer 12a on the lower side green sheet. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
