HIGHLY RELIABLE SEMICONDUCTOR DEVICE UTILIZING ELECTRODE AIR SHIELDING

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device electrically connecting a semiconductor chip with a wiring substrate, suitable for repair and recycle and easy in disassembling.

SOLUTION: An electrode formed on the semiconductor chip and an electrode formed on the wiring substrate are sealed by using a frame structure that is a vacuum structure or is sealed with gas that does not react with the electrodes. Consequently, the deterioration of the electrodes by an attach from oxygen and water can be prevented without the use of a sealing resin. Moreover, possibility in separation can be improved by achieving electrical connection by the contact of the electrode formed on the semiconductor chip and the electrode formed on the wiring substrate.

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