发明名称 METHOD AND APPARATUS FOR PROVIDING SUBSTRATE COATING HAVING PREDETERMINED RESISTIVITY, AND USE THEREFOR
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and apparatus for providing a substrate coating having a predetermined resistivity. <P>SOLUTION: The method comprises the steps of providing a substrate to be coated in a vacuum chamber, creating a plasma in the chamber, and depositing ions of the plasma on the substrate to form a ta-C (tetrahedral amorphous carbon) substrate coating. The coating step is stopped when the ta-C substrate coating has the predetermined resistivity. The predetermined resistivity is 10<SP>5</SP>to 10<SP>9</SP>&Omega;cm, and preferably about 10<SP>6</SP>&Omega;cm. The substrate may be biased during the method to aid in arriving at the predetermined resistivity. The coating may be employed to reduce the risk of, or prevent electrostatic discharge to or from the substrate, or to provide a seed layer to improve adhesion between the substrate and a further coating. Also described are coatings having predetermined resistivities. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111964(A) 申请公布日期 2006.04.27
申请号 JP20050235978 申请日期 2005.08.16
申请人 NANOFILM TECHNOLOGIES INTERNATL PTE LTD 发明人 SHI XU;CHEAH LI KANG
分类号 C23C14/06;C23C14/32;H01L23/60;H01L33/00;H01L51/52 主分类号 C23C14/06
代理机构 代理人
主权项
地址