CERAMIC PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

A ceramic package and a method for manufacturing the same are provided to widen a heat dissipation area and to prevent the short of a conductive ceramic substrate and a semiconductor chip by using the conductive ceramic substrate and an insulating layer. An insulating layer(13c) and a first metal layer(14d) are laminated to configure a first surface mounting external electrode on a certain region of an upper surface of a conductive ceramic substrate(11) and a certain region of a lower surface thereof through a certain region of a lateral side of the conductive ceramic substrate. A second surface mounting external electrode made of a second metal layer is formed on a certain region of the upper surface of the conductive ceramic substrate and a certain region of the lower surface thereof through a certain region of the other lateral side of the conductive ceramic substrate. A semiconductor chip(15) is mounted on a certain region of the upper surface of the conductive ceramic substrate. The lateral side and the other lateral side of the conductive ceramic substrate include a corner where two lateral sides of the conductive ceramic substrate are connected to each other.