发明名称 |
Coreless substrate and manufacturing method thereof |
摘要 |
The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.
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申请公布号 |
US7517730(B2) |
申请公布日期 |
2009.04.14 |
申请号 |
US20060542175 |
申请日期 |
2006.10.04 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHO SOON-JIN |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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