| 摘要 |
An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at the flat portion, disposed within a housing. Each flat portion is disposed parallel to, and spaced from, the surface of the substrate. Contact feet extend from the flat portions to conductor tracks on the substrate. A pressure plate exerts pressure on the load terminals to hold them in place and establish electrical contact between the contact feet and the conductor tracks, while also establishing thermal contact between the load terminals and the cooling component. The cooling component, the housing, and the pressure plate form a first unit, which is mechanically decoupled from a second unit comprising the substrate and the load terminals.
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