| 摘要 |
FIELD: process engineering. ^ SUBSTANCE: invention relates to process engineering, particularly device and method of laser sintering. Processed chamber comprises optical element (9) to send beam (7) into processing chamber (10). Optical element has surface (9a) directed inside said chamber and wall part (12) that embraces said optical element (9). First gas inlet hole (16) is arranged on one side of optical element (9) so that first outward gas flow (18) flows, in fact, tangentially to surface (9a) of optical element (9). Second gas outlet hole (23) is arranged to allow second outward gas flow (25) to flow in the same direction, flow (18) flows along, and at a distance from surface (9a). Proposed method comprises directing electromagnetic radiation beam (7) through inlet opening into processing chamber (10) and sending first (18) and second (25) gas flows therein. ^ EFFECT: ruling out of beam deflection caused by temperature differences nearby inlet opening. ^ 24 cl, 2 dwg |
