ELASTIC WAVE DEVICE, COMMUNICATION MODULE APPARATUS, AND METHOD FOR MANUFACTURING ELASTIC WAVE DEVICE

摘要

Provided is an elastic wave device wherein a gap between a mounting substrate and a cover member is sufficiently filled with a molding resin, and the cover member is not susceptible to denting. An elastic wave device 1 is provided with an elastic wave element 2 that has: first supporting layers 15a1, 15a2 that are provided on a piezoelectric substrate 13; a second supporting layer 15b that is provided on the piezoelectric substrate 13 such that the second supporting layer surrounds the first supporting layers 15a1, 15a2 in plan view; and a cover member 16 that is provided on the first supporting layers 15a1, 15a2, and the second supporting layer 15b. The elastic wave device is also provided with: a mounting substrate 3 on which the elastic wave element 2 is mounted; and a molding resin 7, which is provided on the mounting substrate 3, and which seals the elastic wave element 2. The thickness of the first supporting layers 15a1, 15a2 is less than that of the second supporting layer 15b. The cover member 16 is bent in a protruding shape toward the piezoelectric substrate 13 such that the cover member is to be away from the mounting substrate 3. A gap between the mounting substrate 3 and the cover member 16 is filled with the molding resin 7.