发明名称 Cooling structure of electronic device
摘要 A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect.
申请公布号 US9629265(B2) 申请公布日期 2017.04.18
申请号 US201313780005 申请日期 2013.02.28
申请人 NEC CORPORATION 发明人 Nagasaka Yorito
分类号 H05K7/20;H05K5/00;H05K5/02;H05K7/14 主分类号 H05K7/20
代理机构 代理人
主权项 1. An electronic device comprising: a housing comprising a front face and a rear face which are distanced from each other in a longitudinal direction; a plurality of fans which are arranged inside the housing close to the front face so as to cause cooling air to flow downstream in the longitudinal direction from the front face to the rear face of the housing; a central processing unit (CPU) which is arranged downstream of the plurality of fans in the housing and positioned to allow the cooling air to directly flow therethrough; a plurality of memory devices adjacent to the CPU in a width direction, substantially normal to the longitudinal direction, of the housing; and a plurality of power source units which are positioned opposite to each other and spaced out from each other in the width direction of the housing, wherein the plurality of power source units are each positioned further downstream of the cooling air from the plurality of memory devices such that the cooling air passing through one of the memory devices passes into one of the power source units, and wherein the plurality of power source units are each positioned not to be aligned linearly with the CPU in the longitudinal direction of the housing.
地址 Tokyo JP