Thermally actuated printed circuit board retainers

摘要

Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation.

主权项

1. A thermally actuated printed circuit board (PCB) retainer assembly comprising:
a heat sink having an elongated groove having first and second elongated walls configured to receive a printed circuit board; and a printed circuit board retainer comprising:
a first and second complementary elongated bodies each having a first elongated face and a second elongated face disposed opposite said first elongated face, wherein the second elongated face of each elongated body is angled relative to the first elongated face, wherein the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation such that movement of the second elongated faces relative to each other causes the first elongated faces of the elongated bodies to move laterally apart, wherein the first elongated face of the first elongated body is in contact with the printed circuit board and wherein the first elongated face of the second elongated body is in contact with the second elongated wall of the groove, and at least one thermally actuated element in contact with at least one of the elongated bodies such that heat from the received printed circuit board causes the temperature actuated element to expand and thereby apply a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation thereby securing the printed circuit board to the heat sink,
wherein the first elongated body is constrained such that the applied force does not result in the significant movement of the first elongated body in a direction parallel to the first elongated face.