发明名称 Selective die electrical insulation by additive process
摘要 Additive processes are employed for electrically insulating selected surface regions on a stack of die; and methods for electrically interconnecting die in a stack of die, include additive processes for electrically insulating selected surface regions of the die. Regions that are not insulated according to the invention are available for electrical connection using electrically conductive material applied in flowable form to make electrically conductive traces.
申请公布号 US9490230(B2) 申请公布日期 2016.11.08
申请号 US201514868090 申请日期 2015.09.28
申请人 Invensas Corporation 发明人 Leal Jeffrey S.
分类号 H01L21/31;H01L21/469;H01L23/00;H01L21/02;H01L21/56;H01L25/065;H01L21/324;H01L21/768;H01L25/00 主分类号 H01L21/31
代理机构 Lerner, David, Littenberg, Krumholz & Mentlik, LLP 代理人 Lerner, David, Littenberg, Krumholz & Mentlik, LLP
主权项 1. A method for forming a stacked die assembly, comprising: on a plurality of die, electrically insulating a selected interconnect pad of a plurality of interconnect pads exposed at a selected region of a die by selectively applying a dielectric material onto the selected interconnect pad in the selected region of the die by selectively depositing at least one of a spot or a line of dielectric material via a nozzle onto the selected region of the die, the selectively depositing leaving nonselected interconnect pads exposed and free from depositing of the dielectric material thereon, such that the nonselected interconnect pads are available for electrical interconnection without requiring the deposited dielectric material to be removed from the nonselected interconnect pads, the nozzle being controlled so that the dielectric material flows from the nozzle during intervals when a flow axis of the nozzle is directed at the selected interconnect pad and does not flow from the nozzle during intervals when the flow axis is directed at an unselected interconnect pad; and stacking the plurality of die such that front sides of the die are arranged in a plurality of parallel planes, wherein at least some of the interconnect pads are aligned in respective columns extending transverse to the parallel planes, wherein in the stacked die assembly, at least one nonselected interconnect pad in a column is available for electrical interconnection and the selected interconnect pads in the same column are electrically insulated.
地址 San Jose CA US