Compute intensive module packaging

摘要

A package for a multi-chip module includes a top cold plate and a bottom plate whose perimeters are in thermal communication so the plates together completely encase the module except for a connector passing through the bottom plate. The cold plate has copper tubing pressed into a groove formed in a serpentine pattern. The perimeter of the cold plate has thermal conduction fins which mate with thermal conduction slots in the perimeter of the bottom plate. Thermal interface material is disposed in gaps between the plates and chips on the module, the gaps having dimensions controlled by support ribs of plates which abut the module substrate. The cold plate is used on the hottest side of the module, e.g., the side having computationally-intensive chips such as ASICs. A densely packed array of these packages can be used in a central electronic complex drawer with a shared coolant circulation system.

主权项

1. A package for an integrated circuit chip module comprising:
a generally planar substrate having first and second opposing surfaces; a plurality of integrated circuit chips mounted on said first surface of said substrate; a first heat sink provided with a plurality of pockets to accommodate and provide thermal communication with said plurality of integrated circuit chips, said first heat sink having sides forming a perimeter; a second heat sink located opposite said first heat sink with respect to said substrate, said second heat sink having sides forming a perimeter which is in continuous direct contact with the perimeter of said first heat sink such that said first and second heat sinks together substantially surrounding said integrated circuit chips on all sides; and thermal interface material disposed in a gap between said first heat sink and the at least one of said plurality of integrated circuit chips, wherein said gap has a dimension which is determined by at least one support rib of said first heat sink which forcibly abuts said substrate.