| 摘要 |
A dielectric composition which may be used in multilayer dielectrics is provided which consists of a glass binder and particles of a ceramic powder wherein the amounts of these two ingredients are correlated such that the ceramic powder substantially saturates the glass binder so as to insure the solderability of the conductors in the multilayered structure but does not substantially exceed the saturation point so as to cause a porous or non-sealed structure to be formed.
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