COMPENSATING BASE FOR LEAD-FRAME BONDING

摘要

Bonding of lead frames to ceramic substrates is performed on a bonder with a compensating base. The compensating base includes a series of cantilever spring elements attached to a rigid support. The elements are reduced in cross sectional area near the point of attachment to the rigid support. A free end of each of the spring elements is placed under each point of the substrate to which a lead is to be bonded. The elements accommodate to variations in thickness and waviness of the substrate so that it does not crack during the bonding operation.