| 发明名称 | Pre-treatment method for plating and storage medium | ||
| 摘要 | A pre-treatment method for plating can form a plating layer having sufficient adhesivity on an inner surface of a recess and on a surface of a substrate at an outside of the recess even when the recess has a high aspect ratio. The pre-treatment method for plating includes a preparation process of preparing the substrate having the recess; a first coupling layer forming process of forming a first coupling layer 21a at least on the inner surface of the recess of the substrate by using a first coupling agent; and a second coupling layer forming process of forming a second coupling layer 21b at least on the surface of the substrate at the outside of the recess by using a second coupling agent after the first coupling layer forming process. | ||
| 申请公布号 | US9523153(B2) | 申请公布日期 | 2016.12.20 |
| 申请号 | US201414548893 | 申请日期 | 2014.11.20 |
| 申请人 | TOKYO ELECTRON LIMITED | 发明人 | Tanaka Takashi;Inatomi Yuichiro;Iwai Kazutoshi;Iwashita Mitsuaki |
| 分类号 | C23C28/00;C23C28/02;C23C18/04;C23C18/06;C23C18/16;C23C18/32;H01L21/768;H01L21/288;C23C18/18;C23C18/02;C23C18/12;C23C18/38 | 主分类号 | C23C28/00 |
| 代理机构 | Pearne & Gordon LLP | 代理人 | Pearne & Gordon LLP |
| 主权项 | 1. A pre-treatment method for plating, the pre-treatment method comprising: a preparing process of preparing a substrate having a recess; a first coupling layer forming process of forming a first coupling layer at least on an inner surface of the recess of the substrate by using a first coupling agent; and a second coupling layer forming process of forming a second coupling layer at least on a surface of the substrate at an outside of the recess by using a second coupling agent which is different from the first coupling agent after the first coupling layer forming process. | ||
| 地址 | Tokyo JP | ||