| 摘要 |
<p>A solder based on indium and contg. up to 75% Pb, having a m.pt. 150-300 degrees C, is esp. suitable for soldering to Au terminations on semiconductor devices. A partic. compsn. is 50% In, 50% PB. The solder is applied either by dip-soldering at least one of the surfaces to be bonded, or by placing a solid plate of solder between the two surfaces and heating for 3-4 sec. to flow. Solubility of Au in the solder is low compared with prior art solders and adhesion between Au and substrate is therefore not weakened.</p> |
