| 摘要 |
1482012 Component packages; printed circuits MINNESOTA MINING & MFG CO 3 Oct 1974 [4 Oot 1973] 42997/74 Headings H1K and H1R In a batch process for manufacturing a plurality of ceramic mounting pieces for electronic component packages, the mounting pieces are constituted by repeating units in a ceramic sheet structure, and all metallic regions to be gold-plated are electrically connected across lines of eventual severance and also to a common metallized region for supplying the plating current. Conductive regions where plating is not required may be masked. As shown, the sheet structure comprises laminated ceramic sheets 70, 72, 74 each bearing appropriate screened conductor patterns, providing in particular mounting pads 32, internal terminals 40 connected via conductors 46 to external terminals 42, and current collectors in the form of marginal metallizations 30, 48, 54. Aligned perforations 26 provide lines of severance and also electrical connection between layers because of their at least partially metallized walls. Slots 60 cut into sheet 70 facilitate separation or other cutting means such as a laser beam may be employed. Nickel-plating may precede gold-plating. |
