ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To suppress cracks on an element assembly generated by tensile stress due to thermal shrinkage of a solder fillet.SOLUTION: An external electrode 120 includes: a sintered body layer 121 containing sintered metal; a glass layer 122 made from material having an electric insulation property; and a metal layer 123 containing at least one of Sn and Cu. The sintered body layer 121 is provided on an element assembly 110 from each end surface to at least one of its principal surface so as to cover each end surface of the element assembly 110. The glass layer 122 constitutes part of the external electrode 120's surface by being directly provided on the sintered body layer 121's part on each end surface side of the element assembly 110 so as to extend in a direction orthogonal to a side surface of the element assembly 110. The metal layer 123 constitutes other part of the external electrode 120's surface by being provided so as to cover the sintered body layer 121's part other than part covered by the glass layer 122.SELECTED DRAWING: Figure 2