Fabrication of multilayer circuit elements

摘要

Wafer-level methods of forming circuit elements, such as multilayer inductors or transformers, are provided. The methods include, for instance: forming, in at least one layer above a substrate, at least one conductive portion of the circuit element; providing an uncured polymer-dielectric material surrounding, at least in part, and overlying the conductive portion(s) of the element; partially curing the polymer-dielectric material to obtain a partially-hardened, polymer-dielectric material; and polishing the partially-hardened, polymer-dielectric material down to the conductive portion(s). The polishing planarizes the partially-hardened, polymer-dielectric material and exposes an upper surface of the conductive portion(s) to facilitate forming at least one other conductive portion of the element above and in electrical contact with the conductive portion(s). After polishing, curing of the polymer-dielectric material is completed. In one embodiment, the conductive portion(s) and the other conductive portion(s) define, at least in part, a conductive coil(s) of the element.

主权项

1. A method comprising:
forming a circuit element above a substrate, the forming comprising:
forming, in at least one layer above the substrate, at least one conductive portion of the circuit element;providing an uncured polymer-dielectric material surrounding, at least in part, and overlying the at least one conductive portion of the circuit element;partially curing the polymer-dielectric material to obtain a partially-hardened, polymer-dielectric material;polishing the partially-hardened, polymer-dielectric material down to the at least one conductive portion of the circuit element; andforming at least one other conductive portion of the circuit element above and in electrical contact with the at least one conductive portion of the circuit element, the at least one other conductive portion of the circuit element comprising a conductive vias portion of the circuit element in contact with the lower conductive portion; andsubsequent to forming the conductive vias portion of the circuit element, providing another layer of the uncured polymer-dielectric material surrounding, at least in part, and overlying the conductive vias portion of the circuit element, partially hardening the another layer of uncured polymer-dielectric material over the conductive vias portion of the circuit element to obtain a partially-hardened, upper polymer-dielectric material.