MEMS Sensor Component

摘要

A MEMS sensor component with a reduced sensitivity to internal or external stress and small spatial dimensions is provided. The component comprises a MEMS chip arranged in a cavity below a cap and elastically mounted to a carrier substrate by a connection element in a flip-chip configuration.

主权项

1. A MEMS sensor component, comprising:
a carrier substrate; an ASIC chip embedded in the carrier substrate; a MEMS chip arranged on or above the carrier substrate; a cap arranged above the carrier substrate, wherein the cap encloses a cavity and the MEMS chip is arranged in the cavity; a solder pad at a bottom side of the carrier substrate; an electrical interconnection between the ASIC chip and the solder pad; and a connection element comprising an elastically deformable spring element, wherein the connection element mechanically connects the MEMS chip in a flip-chip configuration to the carrier substrate and wherein the connection element electrically connects the MEMS chip to the interconnection.