ELECTRICAL CONNECTING MEANS FOR MICRO-ELECTRONIC CIRCUIT

摘要

1320124 Circuit assemblies; integrated circuits SIEMENS AG 19 Jan 1971 [21 Jan 1970] 2675/71 Headings H1K and H1R [Also in Division H2] A microelectronic circuit is provided with leads which comprise conducting paths on an insulating carrier, each conducting path having one end as a plug-in contact tongue and the other end projecting over the edge of an opening etched through said carrier. In the embodiment described the carrier 4 comprises a thin foil of a glass-fibre reinforced resin having conducting paths 6 which are formed by etching a copper foil covering one surface. The opening 5 is also formed by etching a copper foil on the opposite surface and then using the remaining foil as a resist in etching the carrier material. The conducting paths can be completed by electroplating with gold. The ends 7 can be connected to the microcircuit by soldering, welding or adhesion. The circuit and carrier can be pitted in a synthetic resin by casting or injection moulding. The conducting paths can alternatively be produced by firstly electroplating the required portions of the copper foil and then using the electrodeposited portions as an etching mask so that the remaining portions can be etched away. Reference has been directed by the Comptroller to Specification 1,209,901.