Novel compounds and process

摘要

Radiation (thermal and light)-sensitive polymers are provided which are characterized by the recurring unit of the formula: R' ¦ --CH---CH---CH--CH2-- ¦¦ COOR2COOR3 wherein R' is lower-alkoxy or phenyl; one of R2 and R3 is hydrogen and the other is O(SO2N3)x PARALLEL -A-O-C-NH- ANGLE R''y WHEREIN A = alkylene from 2 to 10 carbon atoms having 2 to 6 carbon atoms between valencies, R'' = lower-alkyl or halogen, x is 1 to 2, y is 0 to 2, and x + y = 1 to 3. Water soluble salts also disclosed. The polymers are useful for chemically bonding basic dyestuffs to non-dyereceptive substrates (e.g. polyethylene) by coating the substrate with radiation sensitive polymer and exposing the coated substrate to irradiation. The treated substrate is then contacted with a basic dyestuff which bonds thereto via the free carboxylic groups in the coating. The irradiation can be carried out imagewise to produce an appropriate image on the substrate which image is developed by dissolving out unexposed radiation-sensitive polymer prior to application of the dye. Bonding of the radiation-sensitive polymers of the invention to substrates in the above manner can also be employed as a means of rendering hydrophilic a variety of substrates which are hydrophobic.