发明名称 |
System for maintaining uniform copper etching efficiency |
摘要 |
System and apparatus for the controlled etching of copper work pieces with ferric chloride etchants. The working solution is constantly monitored with regard to its oxidation reduction potential (ORP) by comparison with a standard solution or voltage. To reduce the build up of etched copper in the working solution, an ORP controller activates the removal of specific quantities of that solution which are then replaced in precise stoichiometric proportions with fresh etchant. Simultaneously, oxidant is injected into the fluid to reoxidize ferrous ions to ferric ions. The solution is constantly monitored and the ORP control means repeats the above procedure as often as necessary to maintain the ORP of the fluid within an acceptable range.
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申请公布号 |
US3951711(A) |
申请公布日期 |
1976.04.20 |
申请号 |
US19740517665 |
申请日期 |
1974.10.24 |
申请人 |
GENERAL DYNAMICS CORPORATION |
发明人 |
SNYDER, H. BEN |
分类号 |
C23F1/46;H05K3/06;(IPC1-7):C23F1/08 |
主分类号 |
C23F1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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