摘要 |
<p>Shaping process for ceramics, esp. dielectrics, used in mfg. electric capacitors, comprises (ae mixing a ceramic powder with a viscous liq. binder to make a homogeneous dispersion, (b) casting the dispersion to obtain a flat foil with a constant thickness, (c) pressing and cutting at least part of the foil, the pressure and temp. used in pressing being sufficient to compact the foil and to eliminate the binder. Cutting may be undertaken with the pressing operation in the same press, using a punch and die, or immediately thereafter, and a stack of at least two foils is pref. subjected to the pressing operation. Foils e.g. with a surface of a few mm2, 200 mu m thick for capacitors of 4.7-3,600 pF ma be obtd. The dielectric foils have a breakdown voltage over 2,000 V, corresp. to a dielectric strength 5-10 times greater than that of conventional foils.</p> |