| 摘要 |
1527108 Forming multi-layer conductors by electro-plating WESTERN ELECTRIC CO Inc 8 Dec 1975 [10 Dec 1974 12 May 1975] 50291/75 Heading C7B Electrical conductors are formed on an insulating substrate for the inter-connect pattern of an integrated circuit by forming over the substrate in turn a Ti layer e.g. 1500-3000Š thick in a desired pattern, a Pd layer e.g. 200-3000A thick, a Cu layer e.g. 3000-7000A thick, then electroplating in turn additional Cu on to a portion of the first Cu layer e.g. to a total thickness of 25000- 40000Š, a Ni layer e.g. 8000-20000Š, a Au layer e.g. 15000-25000Š on at least a portion of the Ni layer, and removing those portions of the Ti, Pd and Cu layers not covered by the electro-plated metals, e.g. by immersion in ammonium persulphate solution (for Cu) and HF solution (for Ti). The Ti, Pd and first Cu layers may be formed by electron gun evaporation or sputtering. The substrate may be alumina on which is deposited Ta or Ti nitride resistor/capacitor elements. The resulting structure may be heated at 200 to 400‹C. A photo-resist may be applied, exposed and developed after the first Cu and the Ni layers. |
