| 摘要 |
An apparatus for electroplating selected portions of a strip comprises means for intermittently moving the strip through successive stations. Means are provided at one of the stations for selectively electroplating selected portions of the strip and comprises upper and lower press members which are movable relatively toward and away from one another. An upper mask of resilient material is provided on the upper member and a lower mask of resilient material is provided on the lower member. The lower mask has a plurality of openings therein having the configuration of the selected portion which is to be plated. When the upper and lower members are moved toward one another, the strip is gripped. The lower member has a plurality of openings therein. The openings in the lower member have their lower ends chamfered and extend to a first chamber in the lower member. A plurality of tubes are mounted in said first chamber and have their upper ends extending into the chamfered portions of the openings in the lower member. The lower member has a second chamber and an inlet to the second chamber. The second chamber communicates with the interior of the tubes such that electroplating solution may be passed through the inlet to the second chamber and, in turn, through each of the tubes to direct electroplating solution against the underside of the exposed selected portions of the strip, the solution thereafter passing along the chamfered portions to the first chamber and to an outlet from the first chamber.
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