| 摘要 |
A carrier for processing semiconductor materials consisting of a first removable mounting boat with supporting branches having grooves for receiving first type semiconductor substrates thereon, and a second mounting boat with a pair of elongated supporting members having grooves for receiving second type semiconductor substrates thereon. The mounting of the first type semiconductor substrates to the first boat can be independently performed and after this mounting, the first boat is then coupled with the second tupe semiconductor substrates. When the first and second boats are coupled, the two types of semiconductor substrates are aligned on the second mounting boat alternately between adjacent substrsates in a juxtaposed configuration. Thereby, handling of the two type of conductors are remarkably facilitated.
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