发明名称 Binding procedure for electric bundle of leads - is designed for parallel conductors of circuit
摘要 <p>The binding procedure is for a bundle of electrical leads connected in parallel. A thread from a spool is wound around the leads from the outside. At the beginning of threading the loose end is held in a tensioned state and a loop formed in the thread to be wrapped around the bundle of wires. This bundle (A) with loop (D1) formed from the binding thread (C) is wound round at the same time from the opposite side so that with half the circumference of the bundle (A) covered with loop (D1) a further loop (D2) is created and passed through the first one (D1). Whereupon a third loop (D3) is formed and passed through the second (D2) to establish a zig-zag stitching.</p>
申请公布号 DE2533640(A1) 申请公布日期 1977.02.03
申请号 DE19752533640 申请日期 1975.07.28
申请人 EGOROV,BORIS SERGEEVITSCH 发明人 SERGEEVITSCH EGOROV,BORIS
分类号 H01B13/012;(IPC1-7):05K13/06 主分类号 H01B13/012
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