| 发明名称 |
COPPER ALLOY FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, COPPER ALLOY THIN SHEET FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, AND CONDUCTIVE COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, TERMINAL |
| 摘要 |
One aspect of this copper alloy for an electronic and electrical equipment contains: more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; and 0.005 mass % to 0.100 mass % of P, with the balance containing Cu and inevitable impurities, wherein atomic ratios of amounts of elements satisfy 3.00<Ni/P<100.00 and 0.10<Sn/Ni<2.90, and a strength ratio TSTD/TSLD of tensile strength TSTD in a direction perpendicular to a rolling direction to tensile strength TSLD in a direction parallel to the rolling direction exceeds 1.09. |
| 申请公布号 |
US2016369374(A1) |
申请公布日期 |
2016.12.22 |
| 申请号 |
US201414898950 |
申请日期 |
2014.02.20 |
| 申请人 |
MITSUBISHI SHINDOH CO., LTD. ;MITSUBISHI MATERIALS CORPORATION |
发明人 |
MAKI Kazunari;MORI Hiroyuki;YAMASHITA Daiki |
| 分类号 |
C22C9/04;H01B1/02;B22D7/00;C23C30/00;C22F1/08;C22C1/02 |
主分类号 |
C22C9/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A copper alloy for electronic and electrical equipment, comprising:
more than 2.0 mass % to 36.5 mass % of Zn; 0.10 mass % to 0.90 mass % of Sn; 0.15 mass % to less than 1.00 mass % of Ni; 0.005 mass % to 0.100 mass % of P; and a balance containing Cu and inevitable impurities, wherein an atomic ratio Ni/P of an amount of Ni to an amount of P satisfies a relationship of 3.00<Ni/P<100.00, an atomic ratio Sn/Ni of an amount of Sn to an amount of Ni satisfies a relationship of 0.10<Sn/Ni<2.90, and a strength ratio TSTD/TSLD which is calculated from strength TSTD obtained when tensile test is performed in a direction perpendicular to a rolling direction and strength TSLD obtained when tensile test is performed in a direction parallel to the rolling direction exceeds 1.09. |
| 地址 |
Tokyo JP |
