Electroless copper plating soln. - giving copper deposit of bright metallic appearance and improved ductility

摘要

The plating soln. comprises 0.001-0.30 mol/1.Cu salt, 0.001-0.60 mole/1. complexing agent for Cu2+ ions 0.0005-0.75 mole/1. reducing agent to reduce Cu2+ ions, 0.05-2.0 mole/1. alkali hydroxide, and 0.001-1.0 g/1 of R7SO2 N(R')R(C2H4O)mH (in which R7 is 3-12C perfluoroalkyl, R is 1-12C alkylene, R' is H or 1-10C alkyl and m is 1-15) The resultant copper layer is ductile and of improved appearance. The plating soln. is stabilised against spontaneous decomposition. In an example, a ductile bright metallic copper layer was deposited using a bath contg. CuNO3, EDTA, HCHO, NaOH, and fluorad FC g/1 (RTM), with the bath at pH 12.8, and 70 degrees C.