Second bond positioning wire bonder

摘要

An apparatus for automatically positioning a wire bonding machine at a second bond position is provided with a plurality of individually adjustable second bond positioning devices set at second bond positions and cooperable with second bond positioning actuating means. After positioning a semiconductor at a first bond position and completing a first bond, the second bond actuating means cooperating with a second bond positioning device automatically moves the semiconductor to a second bond position. After completing the second bond, the second bond positioning actuating means is released permitting the semiconductor to return to a first bond position as another second bond positioning device is cycled into active position.