发明名称 |
MANUFACTURE OF SEMICONDUCTOR DEVICE |
摘要 |
<p>PURPOSE:To ensure an accurate cut-off of the wiring by drilling a window in a high accuracy to the heat-resistance resin layer prior to installation of the beam lead after formation of the programing wiring layer.</p> |
申请公布号 |
JPS5368088(A) |
申请公布日期 |
1978.06.17 |
申请号 |
JP19760143221 |
申请日期 |
1976.11.29 |
申请人 |
FUJITSU LTD |
发明人 |
TAKADA CHIYUUICHI;ABE RIYOUJI;UCHIYAMA YORIHIRO;MANO TOORU;MORI AKISUKE |
分类号 |
G11C17/00;G11C17/08;H01L21/82 |
主分类号 |
G11C17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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