| 摘要 |
1517920 Photopolymerizable materials HITACHI CHEMICAL CO Ltd 9 May 1975 [10 May 1974 (3)] 19669/75 Heading G2C [Also in Division C3] Photopolymerizable compositions useful for providing a protective imaged film on a substrate to be etched, metal-plated &c. for the production of printed circuit boards or for metal precisionprocessing comprise (A) 15-60 wt. per cent of a photopolymerizable compound having at least two terminal ethylenic groups, (B) 10-79À8% of a reactive high molecular compound containing tetrahydrofurfuryl groups or N-alkoxymethylcarbamoyl groups in side-chains, (C) 0À1-15% of a photopolymerization initiator, (D) 5-50% of a compound having at least 2 epoxy groups and (E) 0À1-20% of a potential curing agent for epoxy resins, the percentages being based on solvent-free composition. The composition is heated after exposure but before development and also after development, (80-300‹C) to strengthen the film image. Other uses include photo-sensitive adhesives, production of reliefs and printing plates.
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